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Semiconductor Manufacturing Equipment Market to Reach $214.12 Billion by 2032 Driven by Innovation and Industry Demand
The Semiconductor Manufacturing Equipment Market is expanding with demand for advanced chip production and increasing semiconductor fabrication investments.
AUSTIN, TX, UNITED STATES, February 28, 2025 /EINPresswire.com/ -- Market Size & Industry Insights
As Per the SNS Insider,“The Semiconductor Manufacturing Equipment market was valued at USD 97.15 billion in 2023 and is expected to grow to USD 214.12 billion by 2032, at a CAGR of 9.21% over the forecast period of 2024-2032.”
The semiconductor manufacturing equipment market is driven by the demand for advanced electronic devices, IoT proliferation, and the expansion of 5G networks. Demand for state-of-the-art manufacturing equipment is propelled by semiconductor technology innovations (smaller transistors and more efficient chips). Also, the change towards Electric vehicles (EVs) and AI Applications drives growth. It, therefore, is making the market grow, as more and more industries like automotive, healthcare, consumer electronics, etc., demand high-performance chips.
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SWOT Analysis of Key Players as follows:
- Tokyo Electron Limited
- ASML
- Hitachi High-Tech Corporation
- EV Group
- Advanced Dicing Technologies
- Evatec
- Nikon Corporation
- FormFactor
- Lam Research Corporation
- KLA Corporation
- Advantest
- Plasma-Therm
- Nordson
- QP Technologies
- Modutek
- Daifuku
- Canon
Key Market Segmentation:
By Process: The semiconductor manufacturing equipment market in front-end held the largest share in 2023, driven by the demand for advanced manufacturing processes including wafer fabrication, photolithography, etching, and deposition in the semiconductor industry. The demand for increasingly advanced and less power-consuming chips needed in various electronic devices, automotive systems, as well as consumer electronics, is a catalyst for this.
From 2024 to 2032, the back-end segment is expected to grow at the fastest pace. Such increase is explained by both the greater complexity of semiconductor packaging and assembly processes as well as next generation applications, including 5G chips, AI, and IoT, which require high-performance chips to be integrated at the package level before being integrated at the board level.
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By Sourcing: The 2.5D semiconductor packaging segment held the majority share in 2023 because of its increased performance, better power efficiency, and interconnect delay by placing chips side by side on an interposer. This technology is used extensively in high performance computing, networking and automotive applications.
For the period from 2024 to 2032, the 3D IC (Integrated Circuit) category is anticipated to have the highest CAGR. 3D IC is an emerging packaging technology that is strongly driven by growing demand for higher performance and lower-power, smaller size solutions for AI, cloud computing, and mobile applications.
By Application: In 2023, Fabs or foundries captured the highest revenue share in the semiconductor fabrication market owing to increasing demand and guiding role in manufacturing semiconductors for consumer electronics, automotive, and telecom industries. These fabs manufacture integrated circuits (ICs) and chips, critical components for devices such as smartphones, computers, and electric vehicles.
From 2024 to 2032, the manufacturing of semiconductor electronics is expected to see significant growth, because of increasing demand for high-performance chips in the field of emerging technologies like AI, IoT, 5G, and autonomous vehicles. Growing movement towards miniaturized electronics, powerful processors, and advanced packaging techniques will further the growth of semiconductor electronics manufacturing. Improvements in fabrication methods.
Asia Pacific Leads Semiconductor Market in 2023 with Europe Set for Rapid Growth Through 2032
In 2023, Asia-Pacific region held the largest share of semiconductor manufacturing equipment market, owing to the already existent semiconductor industry, including countries such as China, South Korea, Taiwan and Japan. These countries host leading semiconductor manufacturers, including Taiwan Semiconductor Manufacturing Co. (TSMC), Samsung Electronis Co. and Intel Corp., that make up a substantial share of global output. The region enjoys cost advantages, a mature supply chain, and strong government support for technology development.
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Europe is expected to experience the fastest CAGR from 2024 to 2032. The growth here can be attributed towards rising investment in semiconductor manufacturing and R&D as the European Union aims to become less dependent on non-EU semiconductor imports. Local chip production growth by initiatives such as European Chips Act and the rising demand for advanced & innovative semiconductor technologies in numerous others industries, including automotive, healthcare & aerospace, is projected to fuel the growth of the market in Europe during the forecast period.
Table of Content - Major Points Analysis
Chapter 1. Introduction
Chapter 2. Executive Summary
Chapter 3. Research Methodology
Chapter 4. Market Dynamics Impact Analysis
Chapter 5. Statistical Insights and Trends Reporting
Chapter 6. Competitive Landscape
Chapter 7. Semiconductor Manufacturing Equipment Market Segmentation, by Process
Chapter 8. Semiconductor Manufacturing Equipment Market Segmentation, by Sourcing
Chapter 9. Semiconductor Manufacturing Equipment Market Segmentation, by Application
Chapter 10. Regional Analysis
Chapter 11. Company Profiles
Chapter 12. Use Cases and Best Practices
Chapter 13. Conclusion
Continued…
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Jagney Dave
SNS Insider Pvt. Ltd
+1 315 636 4242
info@snsinsider.com
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